AITC KINGSMAN memory is designed for high-performance overclocking. The heat spreader is made of pure aluminum for faster heat dissipation, and the custom-performance PCB helps manage heat and provides superior overclocking headroom. Each IC is individually screened for peak performance potential.
COMPATIBILITY TESTED
Part of our exhaustive testing process includes performance and compatibility testing on nearly every motherboard on the market – and a few that aren’t.
XMP 2.0 SUPPORT
One setting is all it takes to automatically adjust to the fastest safe speed for your AITC KINGSMAN kit. You’ll get amazing, reliable performance without lockups or other strange behavior.
ALUMINUM HEAT SPREADER
Overclocking overhead is limited by operating temperature. The unique design of the AITC KINGSMAN heat spreader optimally pulls heat away from the ICs and into your system’s cooling path, so you can push it harder.
DESIGNED FOR HIGH-PERFORMANCE OVERCLOCKING
Each AITC KINGSMAN module is built from a custom-performance PCB and highly-screened memory ICs. The efficient heat spreader provides effective cooling to improve overclocking potential.
LOW-PROFILE DESIGN
The small form factor makes it ideal for smaller cases or any system where internal space is at a premium.
MATCH YOUR SYSTEM
The best high-performance systems look as good as they run. AITC KINGSMAN is available in several colors to match your motherboard, your other components, your case -- or just your favorite color.